Product Strategy for Advanced Semiconductor Assembly Automation

Introduction

A key aspect of microelectronics manufacturing pertains to the interconnection of semiconductor devices with the next level of assembly, either with the package substrate (module manufacturing) or with the printed circuit board (direct die attach). A typical die attachment process consists in depositing an adhesive down onto the substrate, placing the device down at high speed and followed with the curing of the die attach material. A follow on step consists of wire bonding the die to the substrate. As the drive for higher performance and smaller footprint continues, another approach, know as flip chip attachment, has gained traction. Typical flip chip applications include high-end microprocessors, chip sets and graphics processors, wireless and RF modules, medical ICs, automotive sensors and high-speed memory.

In this expert case study, a summary is provided which describes the challenges and solutions encountered by an automation equipment provider that needed to develop a product offering for this growing market.

Challenges

Although there are existing automation solutions for die placement in the market place, they tend to be less than optimum for flip chip assembly. In addition, as the technology of assembly changes, new attributes are required. Key attributes of a successful flip chip assembly cell are :

1. Accuracy : Typical accuracy requirements for die attach are in the 25 microns at 3 sigma range. Flip Chip attachment systems usually need to drive to a 10 microns at 3 sigma level or better.
2. Speed : Typical die bonder systems process dies at a rate of 3000 cph. Increasing the speed of the system to higher levels enhances the attractiveness of the solution. The speed of the system is closely linked to cost of the system. The higher the cost of the system, the higher the speed requirement.
3. Cost : Typical die bonder systems costs in the $300,000 range and any system offering must provide a comparable cost per placement.
4. Flexibility : As assembly requirements change, increasing value is attached to the flexibility of a system to handle various types of components used in assembly.

Expert Solution Provided

As a director of marketing in a capital equipment company, I developed a product strategy for advanced semiconductor assembly that met the challenges previously mentioned. The following activities were conducted as part of a business strategy to attack this new market :

• Detailed analysis of the flip chip market including identification of the total available market (TAM), identification of the serviceable available market (SAM)and growth analysis
• Competitive analysis including the identification of present and upcoming players.
• Product positioning
• Elaboration of a product roadmap
• Managing a flip chip bonder project, developing a new machine to serve the flip chip market that provides better accuracy, higher speed and a lower cost per placement to the end-user.
• Launching of the product to the market place by developing sales tools and managing the marketing communications plan.
• Establishing new sales channels to sell the new product effectively in new geographic regions.

To see the resume of the expert associated with this case study, see the link below.