FEA and Modeling of Mechanical Microstructures

Finite-element analyses (FEM & FEA) play a vital role in modeling mechanical microstructures for sensors, actuators, microflow (gaseous and liquid) systems, and high frequency (>30 GHz) RF wireless systems. These "small" microystems while often trivial in geometry interplay into macrosystems in a much less trivial way, often affecting, for example - stability and accuracy of sensors, parasitics due to packaging, and interface issues of micro to macro that manifest themselves in issues of performance, manufacturing, and robustness.

A biomedical sensors manufacturer came to us with problems manufacturing microchannels and microchambers for FTIR spectroscopy. Their issues of holding material tolerances and the inability to singulate structures from wafer form into diced form without breakage and appropriate cleanliness led Kevin Kennedy Associates experts to a more manufacturable process that strengthened the bonding process using improved techniques validated by FEA, fashioned geometries to preclude contamination, and held tighter tolerance on material thicknesses and mechanical performance. The process was prototyped in-house and transferred into high volume production at one of our partner foundries.

To see the resume of the expert associated with this case study, see the link below.