Microelectronic Fabrication Technology Expert Consultant Resume

• Aerospace
• Defense
• Computer
• Electronics
• Government
• Power
• Manufacturing

This expert has a Ph.D. in Electrical Engineering from the University of New Mexico in Albuquerque, NM.

While attending Pennsylvania State University in State College, PA, this expert received a M.S. in Electrical Engineering.

This expert received a B.S. in Electrical Engineering from the University of Arkansas in Fayetteville, AR.

This expert has an Electronics Technology Degree from Cleveland Institute of Electronics in Cleveland, OH.

This expert has an A.A. in Mathematics from Allan Hancock Junior College in Santa Maria, CA.

Microelectronic Fabrication Technology Expert Consultant Resume

This expert specializes in microelectronic fabrication technology, radiation effects in semiconductor materials and devices, semiconductor device physics and reliability, and semiconductor materials synthesis and characterization. Further expertise includes synthetic diamond high temperature superconductors, integrated passives, and composite material coatings (e.g., cBN).

This expert has extensive knowledge regarding metal-induced crystallization (MIC) of amorphous silicon, amorphous silicon solar cell development, nonvolatile semiconductor memory technology, and synthesis. Other knowledge and skills are specific to deposition and characterization of novel materials for a variety of applications and advanced electronic packaging technology including microelectromechanical systems [MEMS].

This expert is also highly regarded in areas including microelectronics reliability, photonics, microcircuit fabrication, and electronics manufacturing. Other areas of expertise are solar energy materials and solar cells, metallurgical coatings and thin films, materials research, and dielectric materials. Further specialties are smart materials, ultrafine and nano particles, electronics components and technology, surface and coatings technology, renewable energy, and solid state technology and devices.

Consultant, Kevin Kennedy Associates Inc.

Distinguished Professor of Electrical Engineering, College of Engineering, major university

Interim Head of the Department of Electrical Engineering, Distinguished Professor of Electrical Engineering, College of Engineering, major university

Associate Dean of Engineering for Research, Interim Head of the Department of Electrical Engineering, Distinguished Professor of Electrical Engineering, College of Engineering, major university

Associate Dean of Engineering for Research, Distinguished Professor of Electrical Engineering, College of Engineering, major university

Associate Dean of Engineering for Research, Interim Director of the High Density Electronics Center (HiDEC), Distinguished Professor of Electrical Engineering, College of Engineering, major university

Associate Dean of Engineering for Research, Acting Associate Dean for Academic Programs, Interim Director of the High Density Electronics Center (HiDEC), University Professor of Electrical Engineering, College of Engineering, major university

Associate Dean of Engineering for Research, University Professor of Electrical Engineering, Interim Director of the High Density Electronics Center (HiDEC), College of Engineering, major university

Associate Dean of Engineering for Research, University Professor of Electrical Engineering, College of Engineering, major university

University Professor and Head, Department of Electrical Engineering, major university

Professor and Head, Department of Electrical Engineering, major university

Continued to teach courses in microelectronics, electronics manufacturing, and solid-state physics. Developed courses and contributed/edited textbook on advanced electronic packaging technology. Continued research efforts in amorphous silicon solar cell development, novel material development for microelectronic devices, radiation effects in semiconductor materials and high temperature superconductor thin films, nonvolatile semiconductor memory technology, deposition and characterization of synthetic diamond substrates and thin films, deposition and characterization of high temperature superconductor thin films, characterization of quantum-well and modulation-doped heterostructures using photothermal deflection spectroscopy, and conventional multichip module (MCM) packaging technology.

Professor and Head, Department of Electrical Engineering, Director: High Density Electronics Center (HiDEC), major university

Continued to teach courses in microelectronics and solid-state physics. Developed course in electronics manufacturing processes with Industrial Engineering Department. Continued research efforts in amorphous silicon solar cell development, radiation effects in semiconductor materials, nonvolatile semiconductor memory devices including ferroelectrics, and novel material development for microelectronic device applications. Established the High Density Electronics Center (HiDEC) and directed research on synthetic diamond and superconducting thin films for application in multi-chip module (MCM) packaging technology.

Professor and Head, Department of Electrical Engineering, major university

Continued to teach courses in microelectronics area. Developed graduate-level courses in semiconductor surfaces and radiation effects in semiconductor devices and circuits. Extended research to include amorphous silicon solar cell development, radiation effects in semiconductor materials, and novel material development for microelectronic device applications.

Associate Professor and Head, Department of Electrical Engineering, major university

Continued previous activities.

Summer Faculty, Sandia National Laboratories, Albuquerque, New Mexico

Characterization of Sandia's MONOS device technology for radiation hardness.

Associate Professor of Electrical Engineering, major university

Continued to teach undergraduate and graduate level courses in the microelectronics area, completed development of integrated circuit fabrication laboratory and completely restructured all microelectronics electives. Expanded research interests to include optoelectronic devices and the characterization of semiconductor materials.

Assistant Professor of Electrical Engineering, major university

Taught undergraduate courses in electronic circuits, semiconductor devices and integrated circuit processing technology. Began developing senior-level integrated circuit fabrication laboratory. Taught graduate-level courses in solid-state device physics and optoelectronics. Conducted research on MNOS devices and semi-conductor materials.

Adjunct Professor of Electrical Engineering, Department of Electrical and Computer Engineering, University of New Mexico, Albuquerque, NM

Taught graduate level courses in solid-state device physics and integrated circuit processing technology.

Member of the Technical Staff, Sandia National Laboratories, Albuquerque, NM

Designed test equipment for weapons systems. Studied EMP effects on semiconductor devices, radiation effects on semiconductors, and effects of processing on radiation sensitivity of semiconductor devices. Designed, built and equipped a 500 square foot integrated circuit fabrication facility. Developed processing technology for MNOS memory technology and radiation-hardened CMOS technology. Designed, built and equipped a 5500 square foot, class 100 clean room for integrated circuit manufacturing.

Graduate Student, Pennsylvania State University, State College, PA

Attended graduate school under Sandia Laboratories' One Year On Campus educational program.

Member of the Technical Staff, Sandia National Laboratories, Albuquerque, New Mexico

Designed the electrical power system for a large centrifuge located at the Pantex weapons testing facility.

Consulting Activities

Air Force Weapons Laboratory, Kirkland AFB, Albuquerque, New Mexico on EMP, IEMP and SGEMP failure in semiconductors

National Security Agency on semiconductor device design and fabrication

Sandia National Laboratories, Albuquerque, New Mexico on MNOS technology

Gordos of Arkansas, Rogers, Arkansas on hybrid microcircuit fabrication

Washington County Sheriff's Office, Fayetteville, Arkansas on electronic intrusion alarms and mobile communications

Arkansas Power and Light, Little Rock, Arkansas

Texas Instruments, Inc., Sherman, Texas on electromigration and corrosion of metallization systems for integrated circuits

Keithley Instruments, Inc., Cleveland, Ohio on semiconductor materials, devices and processing

Texas Instruments, Inc., Dallas, Texas on radiation hardening of linear CMOS circuits built in SOI

The St. Paul Fire and Marine Insurance Company, Little Rock, Arkansas, on evaluation of fire damage to an electrical supply and control panel

Atmel Corporation, San Jose, California, on semiconductor fabrication technology for hot carrier injection in CMOS EPROMs

Optivision, Inc., Palo Alto, California, on synthetic diamond technology

STMicroelectronics, Dallas, Texas, on method of fabricating an MOS memory array having electrically-programmable and electrically-erasable storage devices incorporated therein

Oklahoma State University, Stillwater, Oklahoma on proper utilization of clean room space located in a research center

The government of the United Arab Emirates to perform an accreditation review of the Electrical Engineering Department of the University of Sharjah

ITT Night Vision of ITT Industries, Roanoke, Virginia, on reliability issues with wire bonding SiC ICs to 40 pin LCCs and packaging sealing for high temperature operation