Electronic Module Plastic Packaging Expert Testimony

This consultant recently served as a testifying expert witness in a major trial involving electronic module plastic packaging where that module contained individually packaged semiconductor devices and other electronic components. Another area of expertise supplied by the consultant was semiconductor packaging review and discussion and semiconductor device physics as it related to the failure of the module in the field. The expert's work included reviews of the extensive technical data supplied by both sides, review and analysis of the depositions and analysis of the capabilities of the opposing experts. A trip to inspect and analyze actual field installations of the client's system where the failures occurred was undertaken. The consultant also took a trip was taken to the client's facility to review manufacturing and test procedures, view installed system in test and discuss the design and test practices used to qualify the module in question. Preparations were made for deposition and product analysis steps defined. The case was settled in the client's favor following successful mediation as the consultant was identified to the opposition and was awaiting deposition.

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